US Patent Issued to University of Electronic Science and Technology of China, Zhuhai YUEXIN Semiconductor on May 13 for "Fabrication method for package structure" (Chinese Inventors)

ALEXANDRIA, Va., June 12 -- United States Patent no. 12,300,511, issued on May 13, was assigned to University of Electronic Science and Technology of China (Sichuan, China) and Zhuhai YUEXIN Semiconductor LLC (Guangdong, China).

"Fabrication method for package structure" was invented by Xianming Chen (Guangdong, China), Yuanming Chen (Guangdong, China), Lei Feng (Guangdong, China), Benxia Huang (Guangdong, China), Yongzhi Zeng (Guangdong, China), Wei He (Guangdong, China) and Yanlin Dong (Guangdong, China).

According to the abstract* released by the U.S. Patent & Trademark Office: "In a fabrication method for a package structure, a copper foil is provided, electroplating is performed on the copper foil to form a cavity sacrificial post, a...