ALEXANDRIA, Va., Aug. 20 -- United States Patent no. 12,394,673, issued on Aug. 19, was assigned to United Semiconductor (Xiamen) Co. Ltd. (Fujian, China).
"Semiconductor manufacturing process" was invented by Dian Han Liu (Shamen, China), Yuan-Chi Pai (Fujian, China) and Wen Yi Tan (Fujian, China).
According to the abstract* released by the U.S. Patent & Trademark Office: "The invention provides a semiconductor manufacturing process, which comprises the following steps: using a computer system to define plurality of shots on a wafer range, distributing a plurality of observation points in each shot, finding out parts of incomplete shots from all of the shots, calculating the number of observation points in each incomplete shot, eliminati...