US Patent Issued to UNITED MICROELECTRONICS on Sept. 30 for "Method for manufacturing semiconductor module including piezoelectric layer" (Singaporean Inventor)

ALEXANDRIA, Va., Sept. 30 -- United States Patent no. 12,433,165, issued on Sept. 30, was assigned to UNITED MICROELECTRONICS CORP. (Hsinchu, Taiwan).

"Method for manufacturing semiconductor module including piezoelectric layer" was invented by Zhi-Biao Zhou (Singapore).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method for manufacturing a semiconductor module is provided. The method includes: providing a substrate, wherein the substrate comprises a front side and at least one semiconductor element formed on the front side; forming a shielding structure on the at least one semiconductor element; forming a piezoelectric layer on the shielding structure."

The patent was filed on July 21, 2023, under Appli...