US Patent Issued to UNITED MICROELECTRONICS on Sept. 23 for "Semiconductor device and method for fabricating the same" (Taiwanese Inventors)

ALEXANDRIA, Va., Sept. 23 -- United States Patent no. 12,426,385, issued on Sept. 23, was assigned to UNITED MICROELECTRONICS CORP. (Hsin-Chu, Taiwan).

"Semiconductor device and method for fabricating the same" was invented by Po-Kuang Hsieh (Kaohsiung, Taiwan) and Shih-Hung Tsai (Tainan, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method for fabricating a semiconductor device includes the steps of providing a first wafer and a second wafer as the first wafer includes a device wafer and the second wafer includes a blanket wafer, bonding the first wafer and the second wafer, performing a thermal treatment process to separate the second wafer into a first portion and a second portion, and then plan...