ALEXANDRIA, Va., Oct. 8 -- United States Patent no. 12,437,991, issued on Oct. 7, was assigned to UNITED MICROELECTRONICS Corp. (Hsinchu, Taiwan).
"Wafer processing method" was invented by Nuo-Wei Luo (Singapore).
According to the abstract* released by the U.S. Patent & Trademark Office: "A wafer processing method includes: providing a wafer, wherein the wafer has a first position and a second position, and the first position faces the second position in a reference direction; coating a photoresist liquid on the wafer; and performing a heating process to heat the wafer coated with the photoresist liquid to form a photoresist layer on the wafer, wherein during the heating process, a temperature of the wafer gradually increases in the refer...