US Patent Issued to UNITED MICROELECTRONICS on Nov. 25 for "Copper pillar bump structure and method of manufacturing the same" (Taiwanese Inventors)

ALEXANDRIA, Va., Nov. 25 -- United States Patent no. 12,482,777, issued on Nov. 25, was assigned to UNITED MICROELECTRONICS CORP. (Hsin-Chu, Taiwan).

"Copper pillar bump structure and method of manufacturing the same" was invented by Chen-Hsiao Wang (Hsinchu, Taiwan) and Kai-Kuang Ho (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A copper pillar bump (CPB) structure is provided in the present invention, including a substrate, a pad on the substrate, a passivation layer covering the substrate and exposing the pad, and a copper pillar on the passivation layer and the pad and connecting directly with the pad. The copper pillar is provided with an upper part and a lower part, and a top surface o...