US Patent Issued to UNITED MICROELECTRONICS on Nov. 18 for "Semiconductor device and method of fabricating the same" (Taiwanese Inventors)

ALEXANDRIA, Va., Nov. 18 -- United States Patent no. 12,477,814, issued on Nov. 18, was assigned to UNITED MICROELECTRONICS CORP. (Hsin-Chu, Taiwan).

"Semiconductor device and method of fabricating the same" was invented by Kuo-Hsing Lee (Hsinchu County, Taiwan), Chun-Hsien Lin (Tainan, Taiwan), Yung-Chen Chiu (Taichung, Taiwan), Sheng-Yuan Hsueh (Tainan, Taiwan) and Chi-Horn Pai (Tainan, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present disclosure provides, the semiconductor device includes a substrate, a first transistor, a capacitor, and two first plugs. The substrate has a high-voltage region and a capacitor region. The first transistor is disposed in the high-voltage region, and includes...