US Patent Issued to United Microelectronics on May 27 for "Semiconductor structure including seal ring structure" (Taiwanese Inventors)

ALEXANDRIA, Va., June 17 -- United States Patent no. 12,315,827, issued on May 27, was assigned to United Microelectronics Corp. (Hsinchu, Taiwan).

"Semiconductor structure including seal ring structure" was invented by Hui-Lung Chou (Kaohsiung, Taiwan), Ching-Li Yang (Pingtung County, Taiwan), Chih-Sheng Chang (Tainan, Taiwan) and Chien-Ting Lin (Tainan, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor structure includes a substrate, a first dielectric layer on the substrate, a second dielectric layer on the first dielectric layer, a seal ring structure including first and second interconnect structures, and a passivation layer on the seal ring structure and the second dielectric layer....