ALEXANDRIA, Va., June 17 -- United States Patent no. 12,315,767, issued on May 27, was assigned to UNITED MICROELECTRONICS CORP. (Hsin-Chu, Taiwan).
"Semiconductor die" was invented by Po-Yu Yang (Hsinchu, Taiwan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A manufacturing method of a semiconductor device includes the following steps. A singulation process is performed to a semiconductor wafer for forming semiconductor dies and includes a first cutting step, a thinning step, and a second cutting step. The first cutting step is configured to form first openings in the semiconductor wafer by etching. A portion of the semiconductor wafer is located between each first opening and a back surface and removed by ...