US Patent Issued to UNITED MICROELECTRONICS on May 13 for "Warpage-reducing semiconductor structure and fabricating method of the same" (Taiwanese Inventors)

ALEXANDRIA, Va., June 12 -- United States Patent no. 12,300,633, issued on May 13, was assigned to UNITED MICROELECTRONICS CORP. (Hsin-Chu, Taiwan).

"Warpage-reducing semiconductor structure and fabricating method of the same" was invented by Da-Jun Lin (Kaohsiung, Taiwan), Chin-Chia Yang (Tainan, Taiwan), Tai-Cheng Hou (Tainan, Taiwan), Fu-Yu Tsai (Tainan, Taiwan) and Bin-Siang Tsai (Changhua County, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A warpage-reducing semiconductor structure includes a wafer. The wafer includes a front side and a back side. Numerous semiconductor elements are disposed at the front side. A silicon oxide layer is disposed at the back side. A UV-transparent silicon nitride...