US Patent Issued to UNITED MICROELECTRONICS on March 25 for "Semiconductor device and method for fabricating the same" (Taiwanese Inventor)

ALEXANDRIA, Va., March 26 -- United States Patent no. 12,261,083, issued on March 25, was assigned to UNITED MICROELECTRONICS CORP. (Hsin-Chu, Taiwan).

"Semiconductor device and method for fabricating the same" was invented by Chia-Chen Sun (Kaohsiung, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method for fabricating a semiconductor device includes the steps of first forming an active device having a gate structure and a source/drain region on a substrate, forming an interlayer dielectric (ILD) layer on the active device, removing part of the ILD layer to form a contact hole on the active device without exposing the active device and the bottom surface of the contact hole is higher than a top su...