ALEXANDRIA, Va., March 12 -- United States Patent no. 12,249,607, issued on March 11, was assigned to United Microelectronics Corp. (Hsinchu, Taiwan).
"Semiconductor structure" was invented by Sheng Zhang (Singapore), Chunyuan Qi (Singapore), Xingxing Chen (Singapore) and Chien-Kee Pang (Singapore).
According to the abstract* released by the U.S. Patent & Trademark Office: "Provided are a semiconductor structure and a manufacturing method thereof. The semiconductor structure includes a carrier substrate, a trap-rich layer, a dielectric layer, an interconnect structure, a device structure layer and a circuit structure. The trap-rich layer is disposed on the carrier substrate. The dielectric layer is disposed on the trap-rich layer. The int...