US Patent Issued to UNITED MICROELECTRONICS on June 24 for "Semiconductor structure and fabrication method thereof" (Taiwanese Inventors)

ALEXANDRIA, Va., June 25 -- United States Patent no. 12,342,585, issued on June 24, was assigned to UNITED MICROELECTRONICS CORP. (Hsin-Chu, Taiwan).

"Semiconductor structure and fabrication method thereof" was invented by Chia-Ling Wang (Yunlin County, Taiwan), Ping-Hung Chiang (Hsinchu, Taiwan), Wei-Lun Huang (Tainan, Taiwan), Chia-Wen Lu (Chiayi County, Taiwan) and Ta-Wei Chiu (Changhua County, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor structure includes a substrate having a first device region and a second device region in proximity to the first device region. A trench isolation structure is disposed in the substrate between the first device region and the second device region...