ALEXANDRIA, Va., July 16 -- United States Patent no. 12,362,305, issued on July 15, was assigned to United Microelectronics Corp. (Hsinchu, Taiwan).
"Semiconductor structure" was invented by Chien-Ming Lai (Tainan, Taiwan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor structure including a first substrate, a first conductive layer, and first bonding pads is provided. The first conductive layer is located on the first substrate. The first conductive layer includes a main body portion and an extension portion. The extension portion is connected to the main body portion and includes a terminal portion away from the main body portion. The first bonding pads are connected to the main body portion ...