US Patent Issued to UNITED MICROELECTRONICS on July 15 for "Method for fabricating inductor module" (Singaporean Inventors)

ALEXANDRIA, Va., July 16 -- United States Patent no. 12,363,921, issued on July 15, was assigned to UNITED MICROELECTRONICS Corp. (Hsinchu, Taiwan).

"Method for fabricating inductor module" was invented by Purakh Raj Verma (Singapore), Su Xing (Singapore), Shyam Parthasarathy (Singapore) and Xiao Yuan Zhi (Singapore).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method for fabricating an inductor module includes steps of: providing a substrate; forming a first inter-level dielectric layer on the substrate; forming a plurality of second inter-level dielectric layers on the first inter-level dielectric layer; forming a trench penetrating at least two of the second inter-level dielectric layers; and forming a...