US Patent Issued to UNITED MICROELECTRONICS on July 1 for "Surface acoustic wave device and method for fabricating the same" (Taiwanese Inventors)

ALEXANDRIA, Va., July 3 -- United States Patent no. 12,348,214, issued on July 1, was assigned to UNITED MICROELECTRONICS CORP. (Hsin-Chu, Taiwan).

"Surface acoustic wave device and method for fabricating the same" was invented by Shih-Hung Tsai (Tainan, Taiwan), Hon-Huei Liu (Kaohsiung, Taiwan) and Chun-Hsien Lin (Tainan, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method for fabricating a surface acoustic wave (SAW) device includes the steps of forming a first dielectric layer on a substrate, forming a piezoelectric layer on the first dielectric layer, forming a second dielectric layer on the piezoelectric layer, performing a photo-etching process to remove the second dielectric layer for formi...