US Patent Issued to UNITED MICROELECTRONICS on Jan. 27 for "Semiconductor structure and fabrication method thereof" (Taiwanese Inventors)

ALEXANDRIA, Va., Jan. 28 -- United States Patent no. 12,538,768, issued on Jan. 27, was assigned to UNITED MICROELECTRONICS CORP. (Hsin-Chu, Taiwan).

"Semiconductor structure and fabrication method thereof" was invented by Chia-Ling Wang (Tainan, Taiwan), Ping-Hung Chiang (Tainan, Taiwan), Ta-Wei Chiu (Changhua County, Taiwan), Chia-Wen Lu (Tainan, Taiwan), Wei-Lun Huang (Tainan, Taiwan) and Yueh-Chang Lin (Tainan, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor structure includes a substrate having a first device region and a second device region in proximity to the first device region. A first trench isolation structure is disposed in the substrate between the first device region and ...