US Patent Issued to UNITED MICROELECTRONICS on Jan. 20 for "Semiconductor device and fabrication method thereof" (Singaporean, Taiwanese Inventors)

ALEXANDRIA, Va., Jan. 20 -- United States Patent no. 12,532,476, issued on Jan. 20, was assigned to UNITED MICROELECTRONICS CORP. (Hsin-Chu, Taiwan).

"Semiconductor device and fabrication method thereof" was invented by Wang Xiang (Singapore), Chia Ching Hsu (Singapore), Shen-De Wang (Hsinchu County, Taiwan), Yung-Lin Tseng (Changhua County, Taiwan) and Weichang Liu (Singapore).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device includes a substrate having a flash memory region and a logic device region, a logic transistor disposed in the logic device region, and a flash memory transistor disposed in the flash memory region. The flash memory transistor includes a metal select gate having two...