US Patent Issued to UNITED MICROELECTRONICS on Jan. 13 for "Semiconductor package and fabrication method thereof" (Taiwanese Inventors)

ALEXANDRIA, Va., Jan. 13 -- United States Patent no. 12,525,566, issued on Jan. 13, was assigned to UNITED MICROELECTRONICS CORP. (Hsin-Chu, Taiwan).

"Semiconductor package and fabrication method thereof" was invented by Kai-Kuang Ho (Hsinchu, Taiwan), Yu-Jie Lin (Taichung, Taiwan) and Yi-Feng Hsu (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package includes a die stack including a first semiconductor die having a first interconnect structure, and a second semiconductor die having a second interconnect structure direct bonding to the first interconnect structure of the first semiconductor die. The second interconnect structure includes connecting pads disposed in a peripher...