US Patent Issued to UNITED MICROELECTRONICS on Feb. 3 for "Semiconductor structure and method for forming the same" (Taiwanese Inventors)

ALEXANDRIA, Va., Feb. 3 -- United States Patent no. 12,543,548, issued on Feb. 3, was assigned to UNITED MICROELECTRONICS CORP. (Hsin-Chu, Taiwan).

"Semiconductor structure and method for forming the same" was invented by Ang Chan (Taipei, Taiwan), Hsin-Jung Liu (Pingtung County, Taiwan), Kun-Ju Li (Tainan, Taiwan), Chau-Chung Hou (Tainan, Taiwan), Fu-Shou Tsai (Keelung, Taiwan), Yu-Lung Shih (Tainan, Taiwan), Jhih-Yuan Chen (Kaohsiung, Taiwan), Chun-Han Chen (Hsinchu, Taiwan), Wei-Xin Gao (Tainan, Taiwan) and Shih-Ming Lin (Taipei, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor structure includes a first dielectric layer on a substrate, a conductive structure disposed in the first die...