US Patent Issued to United Microelectronics on Feb. 3 for "Semiconductor device and method of fabricating the same" (Taiwanese Inventors)

ALEXANDRIA, Va., Feb. 3 -- United States Patent no. 12,543,507, issued on Feb. 3, was assigned to United Microelectronics Corp. (Hsinchu, Taiwan).

"Semiconductor device and method of fabricating the same" was invented by Jia-Rong Wu (Kaohsiung, Taiwan), Yi-An Shih (Changhua County, Taiwan), Hsiu-Hao Hu (Keelung, Taiwan), I-Fan Chang (Tainan, Taiwan), Rai-Min Huang (Taipei, Taiwan) and Po Kai Hsu (Tainan, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "Provided is a semiconductor device including a substrate, a first interconnection structure, and an MTJ device. The first interconnection structure is disposed on the substrate. The MTJ device is reversely bonded to the first interconnection structure. Th...