US Patent Issued to UNITED MICROELECTRONICS on Dec. 9 for "Semiconductor assembly and method for manufacturing the same" (Taiwanese Inventors)

ALEXANDRIA, Va., Dec. 9 -- United States Patent no. 12,494,456, issued on Dec. 9, was assigned to UNITED MICROELECTRONICS CORP (Hsinchu, Taiwan).

"Semiconductor assembly and method for manufacturing the same" was invented by Kun-Ju Li (Tainan, Taiwan), Hsin-Jung Liu (Pingtung County, Taiwan), Zong-Sian Wu (Tainan, Taiwan), Wei-Xin Gao (Tainan, Taiwan), Jhih-Yuan Chen (Kaohsiung, Taiwan), Ang Chan (Taipei, Taiwan), Chau-Chung Hou (Tainan, Taiwan), Hsiang-Chi Chien (Pingtung County, Taiwan) and I-Ming Lai (Kaohsiung, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor assembly and a method for manufacturing the same are provided. The semiconductor assembly includes a first substrate, a first ...