US Patent Issued to UNITED MICROELECTRONICS on April 8 for "Semiconductor structure" (Taiwanese, Singaporean Inventors)

ALEXANDRIA, Va., April 9 -- United States Patent no. 12,272,662, issued on April 8, was assigned to UNITED MICROELECTRONICS Corp. (Hsinchu, Taiwan).

"Semiconductor structure" was invented by Chien-Ming Lai (Tainan, Taiwan), Zhi-Rui Sheng (Singapore) and Hui-Ling Chen (Kaohsiung, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor structure includes a first layer, a second layer, a first interconnection layer, and a second interconnection layer. The first layer includes an upper passive component pattern, and the second layer includes a lower passive component pattern, wherein the upper passive component pattern is opposite to the lower passive component pattern. The first interconnection la...