US Patent Issued to UNITED MICROELECTRONICS on April 8 for "Semiconductor device and method for fabricating the same" (Taiwanese Inventors)

ALEXANDRIA, Va., April 9 -- United States Patent no. 12,272,693, issued on April 8, was assigned to UNITED MICROELECTRONICS CORP. (Hsin-Chu, Taiwan).

"Semiconductor device and method for fabricating the same" was invented by Chun-Ya Chiu (Tainan, Taiwan), Chih-Kai Hsu (Tainan, Taiwan), Ssu-I Fu (Kaohsiung, Taiwan), Yu-Hsiang Lin (New Taipei, Taiwan), Chien-Ting Lin (Tainan, Taiwan), Chia-Jung Hsu (Tainan, Taiwan) and Chin-Hung Chen (Tainan, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method for fabricating a semiconductor device includes the steps of: providing a substrate having a high-voltage (HV) region and a low-voltage (LV) region; forming a base on the HV region and fin-shaped structures on...