US Patent Issued to UNITED MICROELECTRONICS on April 29 for "Surface acoustic wave device and method for fabricating the same" (Taiwanese Inventors)

ALEXANDRIA, Va., June 9 -- United States Patent no. 12,289,088, issued on April 29, was assigned to UNITED MICROELECTRONICS CORP. (Hsin-Chu, Taiwan).

"Surface acoustic wave device and method for fabricating the same" was invented by Hon-Huei Liu (Kaohsiung, Taiwan), Shih-Hung Tsai (Tainan, Taiwan) and Chun-Hsien Lin (Tainan, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method for fabricating a surface acoustic wave (SAW) device includes the steps of forming a buffer layer on a substrate, forming a high velocity layer on the buffer layer, forming a medium velocity layer on the high velocity layer, forming a low velocity layer on the medium velocity layer, forming a piezoelectric layer on the low ve...