US Patent Issued to United Microelectronics on April 22 for "Method for manufacturing semiconductor device" (Taiwanese Inventors)

ALEXANDRIA, Va., June 6 -- United States Patent no. 12,283,481, issued on April 22, was assigned to United Microelectronics Corp. (Hsinchu, Taiwan).

"Method for manufacturing semiconductor device" was invented by Yu Cheng Lin (Tainan, Taiwan) and Wei-Chuang Lai (Tainan, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method for manufacturing a semiconductor device is provided. The method includes a step of performing a chemical mechanical polishing process on a first silicon oxide layer to form a planar surface layer; surface treatment is performed on the planar surface layer to form a treated planarization layer, and a second silicon oxide layer is formed on the treated planarization layer."

The pa...