US Patent Issued to UNITED MICROELECTRONICS on April 22 for "Integrated circuit structure" (Singaporean Inventors)

ALEXANDRIA, Va., June 6 -- United States Patent no. 12,283,557, issued on April 22, was assigned to UNITED MICROELECTRONICS CORP. (Hsin-Chu, Taiwan).

"Integrated circuit structure" was invented by Aaron Chen (Singapore), Chi Ren (Singapore) and Yi Hsin Liu (Singapore).

According to the abstract* released by the U.S. Patent & Trademark Office: "An integrated circuit structure includes an aluminum pad layer on a dielectric stack, a passivation layer covering the aluminum pad layer, and an aluminum shield layer including aluminum routing patterns disposed directly above an embedded memory area and embedded in the dielectric stack. The aluminum shield layer is electrically connected to the uppermost copper layer through a plurality of tungste...