US Patent Issued to UNITED ARAB EMIRATES UNIVERSITY on Jan. 27 for "Microchannel heat sink with TPMS finned structures for enhanced thermal efficiency" (Emirati Inventors)

ALEXANDRIA, Va., Jan. 28 -- United States Patent no. 12,538,800, issued on Jan. 27, was assigned to UNITED ARAB EMIRATES UNIVERSITY (Al Ain, United Arab Emirates).

"Microchannel heat sink with TPMS finned structures for enhanced thermal efficiency" was invented by Saeed Khalfan Ali ALNuaimi (Sharjah, United Arab Emirates), Ahmed Raafat Abdelfattah Mostafa (Sharjah, United Arab Emirates) and Mohamed Moustafa Zaki Ahmed Kamra (Sharjah, United Arab Emirates).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present disclosure in general relates to the field of heat sinks (e.g. microchannel heat sinks). The present disclosure is further directed towards a microchannel heat sink for applications in microchips. Th...