ALEXANDRIA, Va., Jan. 13 -- United States Patent no. 12,522,943, issued on Jan. 13, was assigned to Unison Industries LLC (Jacksonville, Fla.).
"System and method for electroforming a component" was invented by Pei-hsin Kuo (Alplaus, N.Y.) and Edward James Nieters (Burnt Hills, N.Y.).
According to the abstract* released by the U.S. Patent & Trademark Office: "A system and method of inspecting a thickness of metal on an electroformed component. The system capable of scanning the electroformed component with a sensor. The system including a computer for generating a scan data set indicative of the thickness of the metal on the electroformed component. A controller for instructing an anode to deposit additional metal on the electroformed com...