US Patent Issued to UNISANTIS ELECTRONICS SINGAPORE on Oct. 7 for "Pillar-shaped semiconductor device and method for manufacturing the same" (Japanese Inventor)

ALEXANDRIA, Va., Oct. 8 -- United States Patent no. 12,439,644, issued on Oct. 7, was assigned to UNISANTIS ELECTRONICS SINGAPORE PTE. LTD. (Singapore).

"Pillar-shaped semiconductor device and method for manufacturing the same" was invented by Nozomu Harada (Tokyo).

According to the abstract* released by the U.S. Patent & Trademark Office: "On a semiconductor base that extends in a band shape in a direction (first direction) perpendicular to a line X-X' direction (second direction) in plan view, an N+ layer, a P+ layer, and Si pillars that also extend in a band shape in the first direction are formed. Subsequently, a gate insulating layer and gate conductor layers are formed so as to surround the Si pillars. Subsequently, a contact hole w...