US Patent Issued to UNIMICRON TECHNOLOGY on Sept. 23 for "Circuit board structure and method for forming the same" (Taiwanese Inventors)

ALEXANDRIA, Va., Sept. 23 -- United States Patent no. 12,426,168, issued on Sept. 23, was assigned to UNIMICRON TECHNOLOGY CORP. (Taoyuan, Taiwan).

"Circuit board structure and method for forming the same" was invented by Ming-Hao Wu (Taoyuan, Taiwan) and Chia-Ching Wang (Taoyuan, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A circuit board structure is provided. The circuit board structure includes a via hole, a conductive layer, and an alternate stacking of a plurality of circuit layers and a plurality of insulating layers. The via hole penetrates through the plurality of circuit layers and the plurality of insulating layers. The lateral ends of the plurality of insulating layers form the sidewall...