US Patent Issued to UNIMICRON TECHNOLOGY on Oct. 7 for "Plurality of build-up layers in a circuit board structure" (Taiwanese Inventors)

ALEXANDRIA, Va., Oct. 8 -- United States Patent no. 12,439,529, issued on Oct. 7, was assigned to UNIMICRON TECHNOLOGY CORP. (Taoyuan, Taiwan).

"Plurality of build-up layers in a circuit board structure" was invented by Shao-Chien Lee (Taoyuan, Taiwan), Ching-Sheng Chen (Taoyuan, Taiwan), Heng-Ming Nien (Taoyuan, Taiwan) and Pei-Wei Wang (Taoyuan, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A manufacturing method for circuit board structure includes steps of providing a carrier, forming a first build-up layer including a plurality of first circuits, forming a second build-up layer including a plurality of second circuits on a side of the first build-up layer located away from the carrier, attaching...