US Patent Issued to Unimicron Technology on Oct. 7 for "Chip package and method of manufacturing the same" (Taiwanese Inventors)

ALEXANDRIA, Va., Oct. 8 -- United States Patent no. 12,438,060, issued on Oct. 7, was assigned to Unimicron Technology Corp. (Taoyuan, Taiwan).

"Chip package and method of manufacturing the same" was invented by Cheng-Hui Wu (New Taipei, Taiwan), Jeng-Ting Li (Pingtung County, Taiwan), Ping-Tsung Lin (Miaoli County, Taiwan), Kai-Ming Yang (Hsinchu County, Taiwan), Pu-Ju Lin (Hsinchu, Taiwan) and Cheng-Ta Ko (Taipei, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A chip package includes a redistribution layer, a chip, and an encapsulation member. The redistribution layer includes an insulation part, a plurality of first pads and a plurality of second pads, where the insulation part has a first surface,...