US Patent Issued to Unimicron Technology on Nov. 11 for "Electronic packaging structure and manufacturing method thereof" (Taiwanese Inventors)

ALEXANDRIA, Va., Nov. 11 -- United States Patent no. 12,469,769, issued on Nov. 11, was assigned to Unimicron Technology Corp. (Taoyuan, Taiwan).

"Electronic packaging structure and manufacturing method thereof" was invented by Chin-Sheng Wang (Taoyuan, Taiwan), Ra-Min Tain (Hsinchu County, Taiwan), Chih-Kai Chan (Taoyuan, Taiwan) and Jun-Ho Chen (Taoyuan, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "An electronic packaging structure including a first circuit structure, a second circuit structure and at least one electronic device is provided. The bottom side of the first circuit structure has at least one cavity. The first circuit structure is disposed on the second circuit structure. The first cir...