US Patent Issued to Unimicron Technology on May 20 for "Circuit carrier and manufacturing method thereof and package structure" (Taiwanese Inventors)

ALEXANDRIA, Va., June 16 -- United States Patent no. 12,309,943, issued on May 20, was assigned to Unimicron Technology Corp. (Taoyuan, Taiwan).

"Circuit carrier and manufacturing method thereof and package structure" was invented by John Hon-Shing Lau (Taoyuan, Taiwan), Ra-Min Tain (Hsinchu County, Taiwan), Cheng-Ta Ko (Taipei, Taiwan), Tzyy-Jang Tseng (Taoyuan, Taiwan) and Chun-Hsien Chien (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A circuit carrier includes a substrate, a first build-up circuit structure, a second build-up circuit structure, a fine redistribution structure and at least one conductive through hole. The substrate has a top surface and a bottom surface opposite to each o...