US Patent Issued to Unimicron Technology on March 4 for "Circuit substrate structure and manufacturing method thereof" (Taiwanese Inventors)

ALEXANDRIA, Va., March 5 -- United States Patent no. 12,243,838, issued on March 4, was assigned to Unimicron Technology Corp. (Taoyuan, Taiwan).

"Circuit substrate structure and manufacturing method thereof" was invented by Tzyy-Jang Tseng (Taoyuan, Taiwan), Pu-Ju Lin (Hsinchu, Taiwan), Cheng-Ta Ko (Taipei, Taiwan) and John Hon-Shing Lau (Taoyuan, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A circuit substrate structure includes a circuit substrate, at least two chips, and a bridge element. The circuit substrate has a first surface and a second surface opposite to each other. The chips are arranged in parallel on the first surface of the circuit substrate and electrically connected to the circuit ...