US Patent Issued to Unimicron Technology on March 18 for "Light-emitting diode package structure and manufacturing method thereof" (Taiwanese Inventors)

ALEXANDRIA, Va., March 19 -- United States Patent no. 12,255,279, issued on March 18, was assigned to Unimicron Technology Corp. (Taoyuan, Taiwan).

"Light-emitting diode package structure and manufacturing method thereof" was invented by Wen-Yu Lin (Taichung, Taiwan) and Kai-Ming Yang (Hsinchu County, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A light-emitting diode package structure includes a heat dissipation substrate, a redistribution layer, and multiple light-emitting diodes. The heat dissipation substrate includes multiple copper blocks and a heat-conducting material layer. The copper blocks penetrate the heat-conducting material layer. The redistribution layer is disposed on the heat dissip...