US Patent Issued to UNIMICRON TECHNOLOGY on March 11 for "Substrate structure and cutting method thereof" (Taiwanese Inventors)

ALEXANDRIA, Va., March 12 -- United States Patent no. 12,250,776, issued on March 11, was assigned to UNIMICRON TECHNOLOGY CORP. (Taoyuan, Taiwan).

"Substrate structure and cutting method thereof" was invented by Jeng-Ting Li (Taoyuan, Taiwan), Chi-Hai Kuo (Taoyuan, Taiwan), Cheng-Ta Ko (Taoyuan, Taiwan) and Pu-Ju Lin (Taoyuan, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A substrate structure and a cutting method thereof are provided. The cutting method includes the following steps. A first substrate structure is provided, wherein the first substrate structure includes a glass substrate and a redistribution layer disposed on the glass substrate. A laser process is performed on the glass substrate t...