US Patent Issued to Unimicron Technology on Jan. 13 for "Package structure and method for manufacturing the same" (Taiwanese Inventors)

ALEXANDRIA, Va., Jan. 13 -- United States Patent no. 12,525,522, issued on Jan. 13, was assigned to Unimicron Technology Corp. (Taoyuan, Taiwan).

"Package structure and method for manufacturing the same" was invented by Jyun-Hong Chen (Taoyuan, Taiwan), Chi-Hai Kuo (Taoyuan, Taiwan), Pu-Ju Lin (Hsinchu, Taiwan) and Cheng-Ta Ko (Taipei, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A package structure includes a first substrate, a second substrate disposed on the first substrate, a third substrate disposed on the second substrate, and multiple chips mounted on the third substrate. A second coefficient of thermal expansion (CTE) of the second substrate is less than a first CTE of the first substrate. T...