US Patent Issued to Unimicron Technology on Jan. 13 for "Package structure and manufacturing method thereof" (Taiwanese Inventors)

ALEXANDRIA, Va., Jan. 13 -- United States Patent no. 12,525,542, issued on Jan. 13, was assigned to Unimicron Technology Corp. (Taoyuan, Taiwan).

"Package structure and manufacturing method thereof" was invented by Ying-Chu Chen (Chiayi, Taiwan), Jeng-Ting Li (Pingtung County, Taiwan), Chi-Hai Kuo (Taoyuan, Taiwan), Cheng-Ta Ko (Taipei, Taiwan) and Pu-Ju Lin (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A manufacturing method of a package structure includes: forming a redistribution layer on a top surface of a glass substrate; forming a protective layer on the top surface of the glass substrate; cutting the glass substrate and the protective layer such that the glass substrate has a cutting...