US Patent Issued to UNIMICRON TECHNOLOGY on Feb. 10 for "Circuit board structure and manufacturing method thereof" (Taiwanese Inventor)

ALEXANDRIA, Va., Feb. 11 -- United States Patent no. 12,550,246, issued on Feb. 10, was assigned to UNIMICRON TECHNOLOGY CORP. (Taoyuan, Taiwan).

"Circuit board structure and manufacturing method thereof" was invented by Chun Hung Kuo (Taoyuan, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A circuit board structure includes a build-up structure, a graphene layer disposed on the build-up structure, and at least one conductive pillar disposed on the graphene layer, the graphene layer includes an oxidized area not covered by the at least one conductive pillar and a non-oxidized area covered by the at least one conductive pillar, and the at least one conductive pillar is electrically connected to the bui...