US Patent Issued to Unimicron Technology on Dec. 23 for "Electronic package structure and manufacturing method thereof" (Taiwanese Inventors)

ALEXANDRIA, Va., Dec. 23 -- United States Patent no. 12,506,056, issued on Dec. 23, was assigned to Unimicron Technology Corp. (Taoyuan, Taiwan).

"Electronic package structure and manufacturing method thereof" was invented by Chin-Sheng Wang (Taoyuan, Taiwan), Ra-Min Tain (Hsinchu County, Taiwan), Wen-Yu Lin (Taichung, Taiwan), Tse-Wei Wang (Hsinchu, Taiwan), Jun-Ho Chen (Taoyuan, Taiwan) and Guang-Hwa Ma (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "An electronic package structure and its manufacturing method are provided. The electronic package structure includes an interposer, a circuit board, a chip, and a circuit structure. The interposer includes an interposer substrate and a coaxial ...