US Patent Issued to UNIMICRON TECHNOLOGY on Dec. 23 for "Co-packaged structure for optics and electrics" (Taiwanese Inventors)

ALEXANDRIA, Va., Dec. 23 -- United States Patent no. 12,504,591, issued on Dec. 23, was assigned to UNIMICRON TECHNOLOGY CORP. (Taoyuan, Taiwan).

"Co-packaged structure for optics and electrics" was invented by Chin-Sheng Wang (Taoyuan, Taiwan), Kai-Ming Yang (Taoyuan, Taiwan), Chen-Hao Lin (Taoyuan, Taiwan), Pu-Ju Lin (Taoyuan, Taiwan) and Cheng-Ta Ko (Taoyuan, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A co-packaged structure for optics and electrics includes a substrate, an optical module and an electrical connection layer. The optical module includes a carrier and an optical transceiver unit. The carrier is mounted on the substrate. The optical module is mounted on the carrier. The electrical ...