ALEXANDRIA, Va., Aug. 20 -- United States Patent no. 12,396,100, issued on Aug. 19, was assigned to UNIMICRON TECHNOLOGY CORP. (Taoyuan, Taiwan).
"Circuit board structure and manufacturing method thereof" was invented by Chun Hung Kuo (Taoyuan, Taiwan), Kuo-Ching Chen (Taoyuan, Taiwan), Yu-Cheng Huang (Taoyuan, Taiwan) and Yu-Hua Chen (Taoyuan, Taiwan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A circuit board structure including a first circuit board, a second circuit board, a conductive coil and a first molding compound and a manufacturing method thereof. The first circuit board has a first side surface. The second circuit board has a second side surface facing the first side surface and being spaced ap...