ALEXANDRIA, Va., April 2 -- United States Patent no. 12,266,616, issued on April 1, was assigned to Unimicron Technology Corp. (Taoyuan, Taiwan).
"Integrated circuit package structure" was invented by Kai-Ming Yang (Hsinchu County, Taiwan), Chia-Yu Peng (Taoyuan, Taiwan) and John Hon-Shing Lau (Taoyuan, Taiwan).
According to the abstract* released by the U.S. Patent & Trademark Office: "An integrated circuit (IC) package structure includes a chip, a redistribution layer (RDL) structure, a molding compound structure and an electromagnetic interference (EMI) shielding structure. The RDL structure is formed on the chip and electrically connected thereto. The molding compound layer is provided on outer surfaces of the chip and the RDL structu...