US Patent Issued to ULVAC on Nov. 11 for "Etching method" (Japanese Inventors)

ALEXANDRIA, Va., Nov. 11 -- United States Patent no. 12,469,711, issued on Nov. 11, was assigned to ULVAC INC. (Kanagawa, Japan).

"Etching method" was invented by Taichi Suzuki (Kanagawa, Japan), Yasuhiro Morikawa (Kanagawa, Japan), Kenta Doi (Kanagawa, Japan) and Toshiyuki Nakamura (Kanagawa, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present disclosure provides an etching method that includes a resist pattern-forming step of forming a resist layer on a target object, the resist layer being formed of a resin, the resist layer having a resist pattern; an etching step of etching the target object via the resist layer having the resist pattern; and a resist protective film-forming step of forming...