US Patent Issued to ULTRASONIUM on Jan. 28 for "Integrated acoustic and thermal modulation for optimized 3D metal fabrication" (Massachusetts Inventor)

ALEXANDRIA, Va., Jan. 29 -- United States Patent no. 12,208,450, issued on Jan. 28, was assigned to ULTRASONIUM INC (Woburn, Mass.).

"Integrated acoustic and thermal modulation for optimized 3D metal fabrication" was invented by Jack Yanjie Qiu (Woburn, Mass.).

According to the abstract* released by the U.S. Patent & Trademark Office: "This invention pertains to a system and method for three-dimensional (3D) printing using acoustic modulation to control the flow and solidification of various materials, with integrated thermal management and real-time analytical adjustments. The system addresses the challenges of controlling the solidification process in non-solid states, which can lead to defects. It utilizes acoustic emitters for precise...