US Patent Issued to ULTRAMEMORY on June 17 for "Stacked semiconductor, wafer stack, method of manufacturing stacked semiconductor, assistance device, and program" (Japanese Inventor)

ALEXANDRIA, Va., June 19 -- United States Patent no. 12,334,473, issued on June 17, was assigned to ULTRAMEMORY INC. (Tokyo).

"Stacked semiconductor, wafer stack, method of manufacturing stacked semiconductor, assistance device, and program" was invented by Kazuhiko Kajigaya (Tokyo).

According to the abstract* released by the U.S. Patent & Trademark Office: "A laminated semiconductor which enables curbing of manufacturing cost; a wafer laminate; a method for manufacturing the laminated semiconductor; an assistance device; and a program. This laminated semiconductor formed by laminating a plurality of chips is provided with a logic chip; and a memory part that is stacked on the logic chip and has at least one memory chip communicable with ...