ALEXANDRIA, Va., June 4 -- United States Patent no. 12,318,860, issued on June 3, was assigned to ULTEX Corp. (Fukuoka, Japan).
"Plated metal bonding method and plated metal bonding apparatus" was invented by Shigeru Sato (Fukuoka, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A stable bonding processing for metal, of which at least a part is plated, is provided. A plated metal bonding apparatus performs bonding of a first metal and a second metal. At least one from among the first metal and the second metal has a plated bonding portion where the bonding processing is to be performed. A bonding processing unit performs bonding of the first metal and the second metal using sound vibration and/or ultras...