US Patent Issued to U Electronics on May 6 for "Window for far-infrared thermal imaging sensor assembly and a far-infrared thermal image sensor assembly comprising same" (South Korean Inventor)

ALEXANDRIA, Va., June 10 -- United States Patent no. 12,292,335, issued on May 6, was assigned to U Electronics Co. Ltd (Gyeonggi-do, South Korea).

"Window for far-infrared thermal imaging sensor assembly and a far-infrared thermal image sensor assembly comprising same" was invented by Joon Sub Lee (Seoul, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A window for far-infrared thermal imaging sensor assembly, according to the present invention, comprises: an incident surface on which far-infrared rays are incident; and an opposing surface facing a thermal imaging sensor, wherein the window for a far-infrared thermal imaging sensor assembly is bonded to an upper portion of the far-infrared therma...